K4AAG165WA-BCWE00P
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4AAG165WA-BCWE00P |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR4 SDRAM |
| IC-Code | 1GX16 DDR4 |
Produktbeschreibung
| Gehäuse | FBGA-96 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.2V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 3200 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 1G |
| Bit Organization | x16 |
| Density | 16Gb |
| Internal Banks | 16 Banks |
| Generation | 2nd Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4AAG165WA-BCWE00P | 10.000 | 22+ | Anfrage senden |
| K4AAG165WA-BCWE00P | 0 | Anfrage senden | |
| K4AAG165WA-BCWE00P | 10.240 | 22+ | Anfrage senden |
| K4AAG165WA-BCWE00P | 10.240 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| H5ANAG6NCJR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCJR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-WMC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NCMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNC | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| H5ANAG6NDMR-XNCR | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE0 | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE000 | FBGA-96 | 1.2V | 3200 MBPS | 0 C~+85 C |
| K4AAG165WA-BCWE0CT | FBGA-96 | 1.2 V | 3200 MBPS | 0 C~+85 C |