K4B2G0846C-HCK0
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B2G0846C-HCK0 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 256MX8 DDR3 |
| Andere Bezeichnungen | K4B2G0846C-HCK0000 |
| K4B2G0846C-HCK0T |
Produktbeschreibung
| Gehäuse | FBGA-78 |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 1.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1600 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 256M |
| Bit Organization | x8 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Generation | 4th Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B2G0846C-HCK0 | 5.500 | Anfrage senden | |
| K4B2G0846C-HCK0 | 436 | 12+02+ | Anfrage senden |
| K4B2G0846C-HCK0 | 548 | 1322+ | Anfrage senden |
| K4B2G0846C-HCK0 | 106 | 11+ | Anfrage senden |
| K4B2G0846C-HCK0 | 1.280 | 13+ | Anfrage senden |
| K4B2G0846C-HCK0 | 3.840 | Anfrage senden | |
| K4B2G0846C-HCK0 | 6.400 | 13+ | Anfrage senden |
| K4B2G0846C-HCK0 | 10.000 | Anfrage senden | |
| K4B2G0846C-HCK0 | 0 | Anfrage senden | |
| K4B2G0846C-HCK0 | 3.840 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| H5TQ2G83CFR-PBA | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83DFR-PBA | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83DFR-PBCR | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83EFR-PBA | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83EFR-PBA NO USE | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83EFR-PBC 1.83 | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83FFR-PBA | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83FFR-PBC 1.82 | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83FFR-PBCR | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G83GFR-PBA | FBGA-78 | 1.5 V | 1600 MBPS | 0 C~+85 C |