MT29F2G08ABAEAWP:E

Product Overview

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Manufacturer Part No MT29F2G08ABAEAWP:E
Brand MICRON
Item FLASH-NAND
Part No 256MX8 NAND SLC
Alternate Names MT29F2G08ABAEAWP E
MT29F2G08ABAEAWP:E ROHS
MT29F2G08ABAEAWP:E TR
MT29F2G08ABAEAWP:E TR MIC
MT29F2G08ABAEAWP:E TRAY
MT29F2G08ABAEAWPE
MT29F2G08ABAEAWPETR
MT29F2G08ABAEAWPETRAY

Product Details

Package TSOP-48
Outpack TRAY
RoHS RoHS
Voltage 3.3 V
Temperature 0 C~+70 C
Speed 25 NS
Std. Pack Qty 960
Std. Carton
Number Of Words 256M
Bit Organization x8
Density 2G
Production Status Production
Package Material Pb-free
Interface Async only
Level SLC
Speed Grade Async only
Design Revision E
Package TSOP I(48-pin CPL version)
Classification 1-1-1-1 (Die-nCE-RnB-IO Channels)

General Description Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (I/Ox) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection and monitor device status (R/B#). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). There is at least one NAND Flash die per chip enable signal. For further details, see Device and Array Organization. This device has an internal 4-bit ECC enabled. See Internal ECC and Spare Area Mapping for ECC for more information.

Available Offers

Description Qty Datecode
MT29F2G08ABAEAWP:E 250 Get Quote
MT29F2G08ABAEAWP:E 9,000 21+ Get Quote
MT29F2G08ABAEAWP:E 30,000 23+ Get Quote
MT29F2G08ABAEAWP:E 355 Get Quote
MT29F2G08ABAEAWP:E 10,000 2023+ Get Quote
MT29F2G08ABAEAWP:E 2,284 Get Quote
MT29F2G08ABAEAWP:E 900 Get Quote
MT29F2G08ABAEAWP:E 256 Get Quote
MT29F2G08ABAEAWP:E 2,946 19+ Get Quote
MT29F2G08ABAEAWP:E 20,000 23+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
H27U2G8CTR-BCR TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2BTR-BC TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2C TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2CFR-BC TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2CTR-BC TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2CTR-BCR TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2DTR-B TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2DTR-BC TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8F2DTR-BCR TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C
H27U2G8FCTR-BC TSOP-48 2.7V-3.6V 25 NS 0 C~+70 C