MT29F4G08ABBEAH4:E

In Stock

Product Overview

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Manufacturer Part No MT29F4G08ABBEAH4:E
Brand MICRON
Item FLASH-NAND
Part No 512MX8 NAND SLC
Alternate Names MT29F4G08ABBEAH4:ETR
MT29F4G08ABBEAH4E

Product Details

Package VFBGA-63
Outpack TAPE ON REEL
RoHS RoHS
Voltage 1.8 V
Temperature 0 C~+70 C
Speed 25 NS
Std. Pack Qty 1000
Std. Carton
Number Of Words 512M
Bit Organization x8
Density 4G
Production Status Production
Package Material Pb-free
Interface Async only
Level SLC
Speed Grade Async only
Design Revision E
Package VFBGA(63-ball , 9 x 11 x 1.0)
Classification 1-1-1-1 (Die-nCE-RnB-IO Channels)

General Description Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (I/Ox) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection and monitor device status (R/B#). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). There is at least one NAND Flash die per chip enable signal. For further details, see Device and Array Organization.

Stock

Description Qty Unit Price (USD) Datecode Note
MT29F4G08ABBEAH4:E 14,000 1742 In Stock Get Quote
MT29F4G08ABBEAH4:E 14,000 1742 In Stock Get Quote

Available Offers

Description Qty Datecode
MT29F4G08ABBEAH4:E 1,260 Get Quote
MT29F4G08ABBEAH4:E 14,000 17+ Get Quote
MT29F4G08ABBEAH4:E 463 18+ Get Quote
MT29F4G08ABBEAH4:E 16,000 17+ Get Quote
MT29F4G08ABBEAH4:E 14,000 14+ Get Quote
MT29F4G08ABBEAH4:E 5,000 14+ Get Quote
MT29F4G08ABBEAH4:E 200 Get Quote
MT29F4G08ABBEAH4:E 3,000 2021+ Get Quote
MT29F4G08ABBEAH4:E 1,260 Get Quote
MT29F4G08ABBEAH4:E 182 Get Quote

Cross Reference

Description Package Voltage Speed Temperature
MT29F4G08ABBDAH4 VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4:D TR VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH4DTR VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBEAH4 VFBGA-63 1.8 V 25 NS 0 C~+70 C

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
MT29F4G08ABBDAH4ES:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAH5:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHC VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHC:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHC:D TR VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHCD VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBDAHCES:D VFBGA-63 1.8 V 25 NS 0 C~+70 C
MT29F4G08ABBEAH4ES:E VFBGA-63 1.8 V 25 NS 0 C~+70 C
TH58NYG2S3HBA14 BGA-63 1.8 V 25 NS 0 C~+70 C