| Package |
eBGA-64
|
| Outpack |
TRAY
|
| RoHS |
RoHS
|
| Voltage |
3.0v
|
| Temperature |
-40°C~+85°C
|
| Speed |
75 NS
|
| Std. Pack Qty |
864
|
| Std. Carton |
|
| Density |
128M
|
| Nor Family |
J3 Parallel NOR
|
| Lithography |
65nm
|
| Package |
BGA(64-ball Easy, RoHS)
|
Description
Initial release
Add Blank Check function and command.
Add Blank Check specification tBC/MB, update Clear Block Lock-Bits Max Time and Program
time in Table 13, “Configuration Performance” on page 28.
Update ICCR in Table 7, “DC Current Characteristics” on page 21.
Order information with device features digit.
Update part number information in Valid Combination table.
Add a note to clarify the SR output after E8 command in Figure 16, “Write to Buffer Flowchart” on
page 48.
State JESD47E Compliant at front page.
Update ECR.13 description in Table 18, “Enhanced Configuration Register” on page 32.
Correct the typo of comment for offset 24h at CFI from 2048µs to 1024µs.
Correct the typo of tAVQV and tELQV to Max Specifications.
Emphasize the valid and legal command usage at Section 11.0, “Device Command Codes” on
page 47.
Put a link for part numbers after Table 46, “Valid Combinations” on page 65.
Add Buffer Program Time for 128 Words (256 Bytes) at Table 13, “Configuration Performance” on
page 28.
Add JEDEC standard lead width for TSOP56 package at Table 1, “56-Lead TSOP Dimension Table” on
page 13.
