W25Q128JVCIM

Product Overview

IC Picture

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Manufacturer Part No W25Q128JVCIM
Brand WINBOND
Item FLASH-QSPI-NOR
Part No 128MB SPI

Product Details

Package TFBGA-24
Outpack
RoHS RoHS
Voltage 2.7V~3.6V
Temperature -40 C~+85 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Density 128M
Product Family SpiFlash serial flash memory with 4 KB sectors, Dual/Quad I/O
Product Number Density 128 Mbit
Special Options green package (Lead-free, RoHS compliant, Halogen-free(TBBA), Antimony-Oxide-free Sb2O3) & optimized for mobile applications
Company Prefix winbond

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
GD25Q128BYIGR TFBGA-24 3.3 V 133 MHZ -40 C~+85 C
MT25QL128ABA1E12-1SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL128ABA1E14-1SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL128ABA8E12-0SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL128ABA8E12-0SITTR T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL128ABA8E12-1SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL128ABA8E12-1SITTR T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL128ABA8E14-0SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL128ABA8E14-1SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MX25L12845GXDI-08 TFBGA-24 3.3 V 133 MHZ -40 C~+85 C