| Gehäuse |
TSOP-48
|
| Verpackung |
|
| RoHS |
RoHS
|
| Spannungsversorgung |
2.7V-3.6V
|
| Betriebstemperatur |
0 C~+70 C
|
| Geschwindigkeit |
25 NS
|
| Standard Stückzahl |
|
| Abmessungen Karton |
|
Description...................................................................................................................5
1.1 Product List....................................................................................................................................6
1.2 Pin description................................................................................................................................8
1.3 Functional block diagram...............................................................................................................9
1.4 Address role.................................................................................................................................10
1.5 Command Set...............................................................................................................................11
2 Bus Operations............................................................................................................................13
2.1 Command Input............................................................................................................................13
2.2 Address Input...............................................................................................................................13
2.3 Data Input....................................................................................................................................13
2.4 Data Output.................................................................................................................................13
2.5 Write Protect................................................................................................................................13
2.6 Stand-by......................................................................................................................................13
3 DEVICE OPERATION...................................................................................................................14
3.1 Page Read....................................................................................................................................14
3.2 Data Handiling Restriction During Program Sequences......................................................................14
3.3 Page Program...............................................................................................................................14
3.4 Multiple plane program..................................................................................................................15
3.5 Block Erase...................................................................................................................................15
3.6 Multiple plane Block Erase..............................................................................................................16
3.7 Copy-Back Program.......................................................................................................................16
3.8 Multiple plane copy back Program...................................................................................................17
3.9 Special read for copy back..............................................................................................................17
3.10 EDC Operation........................................................................................................................17
3.11 Read Status Register...................................................................................................................19
3.12 Read Status Enhanced.................................................................................................................19
3.13 Read Status Register field definition..............................................................................................20
3.14 Read EDC Status Register............................................................................................................20
3.15 Reset.........................................................................................................................................21
3.16 Cache Read................................................................................................................................21
3.17 Cache Program...........................................................................................................................22
3.18 Multi-plane Cache Program..........................................................................................................22
3.19 Read ID......................................................................................................................................24
3.20 Read ONFI Signature...................................................................................................................26
3.21 Read Parameter Page..................................................................................................................26
3.22 Parameter Page Data Structure Definition......................................................................................26
4 OTHER FEATURES.......................................................................................................................30
4.1 Data Protection and Power on / off sequence...................................................................................30
4.2 Ready/Busy..................................................................................................................................30
4.3 Write protect (#WP) handling........................................................................................................30
5 Device Parameters......................................................................................................................31
6 Timing Diagrams.........................................................................................................................35
7 Package Mechanical...............................................................................................................58
7.1 Power consumptions and pin capacitance for allowed stacking configurations.....................................59
8 Application notes and comments.............................................................................................60
8.1 System Interface using CE# don't care..........................................................................................60
8.2 System Bad Block Replacement....................................................................................................61
8.3 Bad Block Management System....................................................................................................
