Gehäuse | TSOP2 |
Verpackung | TRAY |
RoHS | Leaded |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | normal power & commercial temp |
Geschwindigkeit | 200MHz 3-3-3 |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 8M |
Bit Organization | x16 |
Density | 128M |
Package Material | lead & halogen free |
Hynix Memory | H |
No Of Banks | 4 banks |
Die Generation | 8th |
Product Family | DRAM |
Product Mode | SDR |
Shipping Method | tray |
Teilenummer | Menge | Datecode | |
---|---|---|---|
H57V1262GTR-50C | 3.028 | 11+ | Anfrage senden |
H57V1262GTR-50C | 10.000 | Anfrage senden |