| Gehäuse | TSOP2 |
| Verpackung | TRAY |
| RoHS | Leaded |
| Spannungsversorgung | 3.3V/3.3V |
| Betriebstemperatur | |
| Geschwindigkeit | |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | lead & halogen free |
| No Of Banks | 4 banks |
| Hynix Memory | H |
| Die Generation | 8th |
| Product Family | DRAM |
| Product Mode | SDR |
| Shipping Method | tray |