Gehäuse | TSOP2 |
Verpackung | TRAY |
RoHS | Leaded |
Spannungsversorgung | 3.3V/3.3V |
Betriebstemperatur | |
Geschwindigkeit | |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Package Material | lead & halogen free |
Hynix Memory | H |
No Of Banks | 4 banks |
Die Generation | 8th |
Product Family | DRAM |
Product Mode | SDR |
Shipping Method | tray |