H5TC2G63GFR-PBI

Produktübersicht

IC Picture

Bilder dienen nur der Illustration

Hersteller-Nummer H5TC2G63GFR-PBI
Hersteller SK HYNIX
Produktkategorie DDR3L SDRAM
IC-Code 128MX16 DDR3L
Andere Bezeichnungen H5TC2G63GFR-PBIR

Produktbeschreibung

Gehäuse FBGA-96
Verpackung TRAY
RoHS RoHS
Spannungsversorgung 1.35V
Betriebstemperatur -40 C~+85 C
Geschwindigkeit 1600 MBPS
Standard Stückzahl
Abmessungen Karton
Number Of Words 128M
Bit Organization x16
Density 2G
Operating Temperature industrial temperature(-40°C~85°C) & normal power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
No Of Banks 8 banks
Die Generation 8th
Product Family DRAM
Shipping Method tray

Verfügbare Angebote

Teilenummer Menge Datecode
H5TC2G63GFR-PBI 3.000 18+/19+ ,T Anfrage senden
H5TC2G63GFR-PBI 3.000 18+ Anfrage senden
H5TC2G63GFR-PBIR 3.000 18+/19+ Anfrage senden
H5TC2G63GFR-PBIR 566 18+ Anfrage senden
H5TC2G63GFR-PBIR 3.000 18+19+ Anfrage senden
H5TC2G63GFR-PBI 3.000 Anfrage senden
H5TC2G63GFR-PBI 1.288 Anfrage senden
H5TC2G63GFR-PBI 1.447 Anfrage senden
H5TC2G63GFR-PBI 1.573 Anfrage senden
H5TC2G63GFR-PBI 1.585 Anfrage senden

FFFE (Form, Fit & Functional Equivalents)

Teilenummer Gehäuse Spannungsversorgung Geschwindigkeit Betriebstemperatur
AS4C128M16D3B-12BIN FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3B-12BINTR FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3L-12BIN FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3LA-12BIN FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3LA-12BINTR FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3LB-12BIN FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3LB-12BINTR FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3LC-12BIN FBGA-96 1.35V 1600 MBPS -40 C~+85 C
AS4C128M16D3LC-12BINTR FBGA-96 1.35V 1600 MBPS -40 C~+85 C
EM6HD16EWKG-12IH FBGA-96 1.35V 1600 MBPS -40 C~+85 C