H5TC4G83EFR-PBI

Produktübersicht

IC Picture

Bilder dienen nur der Illustration

Hersteller-Nummer H5TC4G83EFR-PBI
Hersteller SK HYNIX
Produktkategorie DDR3L SDRAM
IC-Code 512MX8 DDR3L

Produktbeschreibung

Gehäuse FBGA-78
Verpackung TRAY
RoHS RoHS
Spannungsversorgung 1.35V
Betriebstemperatur -40 C~+95 C
Geschwindigkeit 1600 MBPS
Standard Stückzahl
Abmessungen Karton
Number Of Words 512M
Bit Organization x8
Density 4G
Operating Temperature industrial temperature(-40°C~85°C) & normal power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
Die Generation 6th
No Of Banks 8 banks
Product Family DRAM
Shipping Method tray

Verfügbare Angebote

Teilenummer Menge Datecode
H5TC4G83EFR-PBI 3.200 Anfrage senden

FFFE (Form, Fit & Functional Equivalents)

Teilenummer Gehäuse Spannungsversorgung Geschwindigkeit Betriebstemperatur
AS4C512M8D3L-12BIN FBGA-78 1.35V 1600 MBPS -40 C~+95 C
AS4C512M8D3LA-12BIN FBGA-78 1.35V 1600 MBPS -40 C~+95 C
AS4C512M8D3LB-12BIN FBGA-78 1.35V 1600 MBPS -40 C~+95 C
AS4C512M8D3LB-12BINTR FBGA-78 1.35V 1600 MBPS -40 C~+95 C
H5TC4G83AFR-PBI FBGA-78 1.35V 1600 MBPS -40 C~+95 C
H5TC4G83CFR-PBI FBGA-78 1.35V 1600 MBPS -40 C~+95 C
H5TC4G83MFR-PBI FBGA-78 1.35V 1600 MBPS -40 C~+95 C
K4B4G0846E-BMK0 FBGA-78 1.35V 1600 MBPS -40 C~+95 C
K4B4G0846E-BMK0 IT FBGA-78 1.35V 1600 MBPS -40 C~+95 C
K4B4G0846E-BMK00CV FBGA-78 1.35V 1600 MBPS -40 C~+95 C