H5TQ2G63DFR-PBL

Produktübersicht

IC Picture

Bilder dienen nur der Illustration

Hersteller-Nummer H5TQ2G63DFR-PBL
Hersteller SK HYNIX
Produktkategorie DDR3 SDRAM
IC-Code 128MX16 DDR3
Andere Bezeichnungen H5TQ2G63DFR-PBL/RDC

Produktbeschreibung

Gehäuse FBGA-96
Verpackung TRAY
RoHS RoHS
Spannungsversorgung 1.5 V
Betriebstemperatur 0 C~+95 C
Geschwindigkeit 1600 MBPS
Standard Stückzahl
Abmessungen Karton
Number Of Words 128M
Bit Organization x16
Density 2G
Operating Temperature commercial temperature(0°C~85°C) & low power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
Die Generation 5th
No Of Banks 8 banks
Product Family DRAM
Shipping Method tray

FFFE (Form, Fit & Functional Equivalents)

Teilenummer Gehäuse Spannungsversorgung Geschwindigkeit Betriebstemperatur
AS4C128M16D3-12BCN FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
AS4C128M16D3A-12BCN FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
AS4C128M16D3A-12BCNTR FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
AS4C128M16D3B-12BCN FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
AS4C128M16D3B-12BCNTR FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
H5TQ2G63BFR-12C FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
H5TQ2G63BFR-PBC FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
H5TQ2G63DFR-12C FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
H5TQ2G63DFR-PBC FBGA-96 1.5 V 1600 MBPS 0 C~+95 C
H5TQ2G63DFR-PBC FBGA-96 1.5 V 1600 MBPS 0 C~+95 C