H5TQ2G83DFR-PBI

Produktübersicht

IC Picture

Bilder dienen nur der Illustration

Hersteller-Nummer H5TQ2G83DFR-PBI
Hersteller SK HYNIX
Produktkategorie DDR3 SDRAM
IC-Code 256MX8 DDR3

Produktbeschreibung

Gehäuse FBGA-78
Verpackung TRAY
RoHS RoHS
Spannungsversorgung 1.5 V
Betriebstemperatur -40 C~+95 C
Geschwindigkeit 1600 MBPS
Standard Stückzahl
Abmessungen Karton
Number Of Words 256M
Bit Organization x8
Density 2G
Operating Temperature industrial temperature(-40°C~85°C) & normal power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
Die Generation 5th
No Of Banks 8 banks
Product Family DRAM
Shipping Method tray

FFFE (Form, Fit & Functional Equivalents)

Teilenummer Gehäuse Spannungsversorgung Geschwindigkeit Betriebstemperatur
AS4C256M8D3-12BIN FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
AS4C256M8D3A-12BIN FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
AS4C256M8D3A-12BINTR FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
H5TQ2G83FFR-PBCBID FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
H5TQ2G83FFR-PBI FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
H5TQ2G83FFR-PBI-TR FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
H5TQ2G83FFR-PBJ FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
IS43TR82560A-125KBL-TR FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
IS43TR82560A-125KBLI-TR FBGA-78 1.5 V 1600 MBPS -40 C~+95 C
IS43TR82560B-125KBLI-TR FBGA-78 1.5 V 1600 MBPS -40 C~+95 C