Gehäuse | TSOP2 |
Verpackung | TRAY |
RoHS | Leaded |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | -40 C~+85 C |
Geschwindigkeit | PC100, CL3 |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 16M |
Bit Organization | x8 |
Density | 128M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 2nd Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Teilenummer | Menge | Datecode | |
---|---|---|---|
HY57V28820AT-SHYUNDAI | 50.000 | Anfrage senden |