Gehäuse | TSOP2(86) |
Verpackung | TRAY |
RoHS | Leaded |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | 0 C~+70 C |
Geschwindigkeit | 166 MHZ |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
HY57V643220TC6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220TP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643222CT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V64322DT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V6532200BTC6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V653220ATC-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V653220BATC-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V653220BCT6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V653220BLTC-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V653220BT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |