Gehäuse | TSOP2(86) |
Verpackung | TRAY |
RoHS | Leaded |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | 0 C~+70 C |
Geschwindigkeit | 166 MHZ |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 4th Gen. |
Shipping Method | tray |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
HY57V643220DT-6 2MX32SDRA | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DT-60 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DT-6DR | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DT/DTP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DTC-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DTP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DTP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DTP-6 2MX32SDR | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DTP-6-C | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220DTP-6DR | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |