Gehäuse | TSOP2(86) |
Verpackung | TRAY |
RoHS | RoHS |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | 0 C~+70 C |
Geschwindigkeit | 166 MHZ |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 1st Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Teilenummer | Menge | Datecode | |
---|---|---|---|
HY57V643220TP-6 | 1.880 | 2005+ | Anfrage senden |
HY57V643220TP-6 | 10.000 | 2006+ | Anfrage senden |
HY57V643220TP-6 | 10.000 | 2005+ | Anfrage senden |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
EM638325TS6-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TS6-6G DC:2010 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TSA-6G | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325TSS-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM638325VF-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220(C)6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V6432200CT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220BATC-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220BCT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |