HY5V26DLFP-S
Produktbeschreibung
| Gehäuse | FBGA |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 3.3 V |
| Betriebstemperatur | 0 C~+70 C |
| Geschwindigkeit | 100MHz, CL3 |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 5th Gen. |
| Power Consumption | low power |
| Shipping Method | tray |