Gehäuse | FBGA |
Verpackung | TRAY |
RoHS | RoHS |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | 0 C~+70 C |
Geschwindigkeit | 166MHz, CL3 |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 4th Gen. |
Power Consumption | low power |
Shipping Method | tray |