Gehäuse | FBGA |
Verpackung | TRAY |
RoHS | RoHS |
Spannungsversorgung | 3.3 V |
Betriebstemperatur | commercial(0°C~70°C) |
Geschwindigkeit | 133MHz, CL3 3-3-3 |
Standard Stückzahl | |
Abmessungen Karton | |
Number Of Words | 8M |
Bit Organization | x32 |
Density | 256M |
Package Material | Lead free |
Hynix Memory | HY |
Die Generation | 1st Gen. |
Power Consumption | normal |
Shipping Method | tray |