K4B2G0446C-HCH9
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B2G0446C-HCH9 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 512MX4 DDR3 |
| Andere Bezeichnungen | K4B2G0446C-HCH9000 |
Produktbeschreibung
| Gehäuse | FBGA-78 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1333 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 512M |
| Bit Organization | x4 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Power | Normal Power |
| Generation | 4th Generation |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B2G0446C-HCH9 | 4.000 | Anfrage senden | |
| K4B2G0446C-HCH9 | 1.700 | Anfrage senden | |
| K4B2G0446C-HCH9 | 12.500 | Anfrage senden | |
| K4B2G0446C-HCH9 | 24.612 | Anfrage senden | |
| K4B2G0446C-HCH9 | 10.240 | 12+ | Anfrage senden |
| K4B2G0446C-HCH9 | 19.200 | 12+ | Anfrage senden |
| K4B2G0446C-HCH9 | 20.000 | Anfrage senden | |
| K4B2G0446C-HCH9 | 1.000 | 11+ | Anfrage senden |
| K4B2G0446C-HCH9 | 20.000 | Anfrage senden | |
| K4B2G0446C-HCH9 | 10.000 | 2011+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4B2G0446B-HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0446C-HCH8 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0446D-HCF9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0446D-HCH0 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0446D-HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0446E-BCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0446E-MCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| MT41J512M4DA-15E ES:H | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| MT41J512M4DA-15E ES:M | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| MT41J512M4DA-15E:H | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |