K4B2G0846B-HCH9
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B2G0846B-HCH9 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 256MX8 DDR3 |
| Andere Bezeichnungen | K4B2G0846B-HCH90 |
| K4B2G0846B-HCH9000 |
Produktbeschreibung
| Gehäuse | FBGA-78 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1333 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 256M |
| Bit Organization | x8 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Generation | 3rd Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B2G0846B-HCH9 | 6.500 | Anfrage senden | |
| K4B2G0846B-HCH9 | 10.240 | Anfrage senden | |
| K4B2G0846B-HCH9 | 10.240 | 13+ | Anfrage senden |
| K4B2G0846B-HCH9 | 6.951 | Anfrage senden | |
| K4B2G0846B-HCH9 | 0 | Anfrage senden | |
| K4B2G0846B-HCH9 | 2.000 | 2010+ | Anfrage senden |
| K4B2G0846B-HCH9 | 10.000 | Anfrage senden | |
| K4B2G0846B-HCH9 | 10.000 | Anfrage senden | |
| K4B2G0846B-HCH9 | 1.200 | 11+ | Anfrage senden |
| K4B2G0846B-HCH9000 | 1.161 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4B2G0846D-HCH9T00 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HCH9TCV | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HYH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846D-HYH9 IC | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846E-BCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846E-H9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846E-MCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846Q-BYH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| K4B2G0846Q-HCH9 | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |
| MT41J256M8DA-15E | FBGA-78 | 1.5 V | 1333 MBPS | 0 C~+85 C |