K4B2G0846BHCF9
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B2G0846BHCF9 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 256MX8 DDR3 |
Produktbeschreibung
| Gehäuse | FBGA-78 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1066 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 256M |
| Bit Organization | x8 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Power | Normal Power |
| Generation | 3rd Generation |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B2G0846BHCF9 | 7.800 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| H5TQ2G83FFR-G7C | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| HXB15H2G800CF-19F | FBGA-78 | 1.5V | 1066 MBPS | 0 C~+85 C |
| K4B2G0846B-HCF8 | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| K4B2G0846B-HCF8000 | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| K4B2G0846BHCF0 | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| K4B2G0846C-HCF8 | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| K4B2G0846D-HCF8 | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| K4B2G0846DHCF7 | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| K4B2G0846E-MCF8 | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |
| MT41J256M8DA-187E ES:H | FBGA-78 | 1.5 V | 1066 MBPS | 0 C~+85 C |