K4B2G1646E-BCK0TDT
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4B2G1646E-BCK0TDT |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR3 SDRAM |
| IC-Code | 128MX16 DDR3 |
Produktbeschreibung
| Gehäuse | FBGA-96 |
| Verpackung | TAPE ON REEL |
| RoHS | RoHS |
| Spannungsversorgung | 1.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 1600 MBPS |
| Standard Stückzahl | 2000 |
| Abmessungen Karton | |
| Number Of Words | 128M |
| Bit Organization | x16 |
| Density | 2G |
| Internal Banks | 8 Banks |
| Generation | 6th Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4B2G1646E-BCK0TDT | 18.000 | 1401+ | Anfrage senden |
| K4B2G1646E-BCK0TDT | 18.000 | 1410+ | Anfrage senden |
| K4B2G1646E-BCK0TDT | 18.000 | 2014+ | Anfrage senden |
| K4B2G1646E-BCK0TDT | 18.000 | Anfrage senden | |
| K4B2G1646E-BCK0TDT | 18.000 | 1401 | Anfrage senden |
| K4B2G1646E-BCK0TDT | 20.000 | 1401+ | Anfrage senden |
| K4B2G1646E-BCK0TDT | 0 | 10,000 | Anfrage senden |
| K4B2G1646E-BCK0TDT | 12.000 | 14+ | Anfrage senden |
| K4B2G1646E-BCK0TDT | 36.000 | 14+ | Anfrage senden |
| K4B2G1646E-BCK0TDT | 36.000 | 2014+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| EM6GD16EWBH-12H | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| EM6GD16EWKG -12H | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63AFR-PBA | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63BFR-12CR | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63BFR-PBCR | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63DFR-PBA | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63DFR-PBCR | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63DFR-PBCR T R | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63FFR-PBA | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |
| H5TQ2G63FFR-PBC USD 1.69 | FBGA-96 | 1.5 V | 1600 MBPS | 0 C~+85 C |