K4B4G0846D-BYK0S3

Produktübersicht

IC Picture

Bilder dienen nur der Illustration

Hersteller-Nummer K4B4G0846D-BYK0S3
Hersteller SAMSUNG
Produktkategorie DDR3L SDRAM
IC-Code 512MX8 DDR3L

Produktbeschreibung

Gehäuse FBGA-78
Verpackung
RoHS RoHS
Spannungsversorgung 1.35V
Betriebstemperatur 0 C~+85 C
Geschwindigkeit 1600 MBPS
Standard Stückzahl
Abmessungen Karton
Number Of Words 512M
Bit Organization x8
Density 4G
Internal Banks 8 Banks
Generation 5th Generation
Power Low VDD(1.35V)

Verfügbare Angebote

Teilenummer Menge Datecode
K4B4G0846D-BYK0S3 100,000+ Anfrage senden

FFFE (Form, Fit & Functional Equivalents)

Teilenummer Gehäuse Spannungsversorgung Geschwindigkeit Betriebstemperatur
H5TC4G83CFR-PBAR FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83CMR-PBA FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83DFR-PBA FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83DFR-PBAR FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83DFR-PBC FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83EFR-PBA FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83EFR-PBAR FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83MFR-PBA FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83MFR-PBA, 1.35V FBGA-78 1.35V 1600 MBPS 0 C~+85 C
H5TC4G83MFR-PBAR FBGA-78 1.35V 1600 MBPS 0 C~+85 C