K4G80325FB-HC22
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4G80325FB-HC22 |
| Hersteller | SAMSUNG |
| Produktkategorie | GDDR5 SDRAM |
| IC-Code | 256MX32 GDDR5 |
Produktbeschreibung
| Gehäuse | FBGA-170 |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 1.35V/1.5V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 8.0 GBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Bit Organization | x32 |
| Internal Banks | 16 Banks |
| Generation | 3rd Generation |
| Power | Normal Power |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4G80325FB-HC22 | 0 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4G80325FB-HC | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC03 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC24 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC25 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC25000 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC25T00 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC28 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC28 D5 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC28 D5 25 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |
| K4G80325FB-HC28000 | FBGA-170 | 1.35V/1.5V | 8.0 GBPS | 0 C~+85 C |