K4H561638B-GLA2
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4H561638B-GLA2 |
| Hersteller | SAMSUNG |
| Produktkategorie | DDR1 SDRAM |
| IC-Code | 16MX16 DDR1 |
Produktbeschreibung
| Gehäuse | FBGA |
| Verpackung | |
| RoHS | Leaded |
| Spannungsversorgung | 2.5 V |
| Betriebstemperatur | 0 C~+85 C |
| Geschwindigkeit | 133 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Low Power |
| Generation | 3rd Generation |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4H561638B-GLA2 | 8.862 | 09+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4H561638A-GCA2 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638A-GCB0 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638A-GLA2 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638A-GLB0 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638B-GCA2 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638B-GCB0 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638B-GLB0 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638C-GCA2 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638C-GCB0 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |
| K4H561638C-GLA2 | FBGA | 2.5 V | 133 MHZ | 0 C~+85 C |