K4M56163PG-RE1L
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4M56163PG-RE1L |
| Hersteller | SAMSUNG |
| Produktkategorie | SDRAM MOBILE |
| IC-Code | 16MX16 SD |
Produktbeschreibung
| Gehäuse | FBGA |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.8 V |
| Betriebstemperatur | -25 C~+70 C |
| Geschwindigkeit | 105MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Generation | 8th Generation |
| Power | Normal |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4M56163PG-RE1L | 12.931 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4M56163PE-BG1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PE-RG1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PF-BG1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PG-BC1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PG-BE1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PG-BF1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PG-BG1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PG-RF1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |
| K4M56163PG-RG1L | FBGA | 1.8 V | 105MHZ | -25 C~+70 C |