K4M56163PI-BG75
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K4M56163PI-BG75 |
| Hersteller | SAMSUNG |
| Produktkategorie | SDRAM MOBILE |
| IC-Code | 16MX16 SD |
| Andere Bezeichnungen | K4M56163PI-BG7500 |
| K4M56163PI-BG75000 | |
| K4M56163PI-BG750JR | |
| K4M56163PI-BG75T00 |
Produktbeschreibung
| Gehäuse | FBGA |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.8 V |
| Betriebstemperatur | -25 C~+85 C |
| Geschwindigkeit | 133 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Generation | 10th Generation |
| Power | Low, i-TCSR & PASR & DS |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4M56163PI-BG75 | 1.200 | 07+ | Anfrage senden |
| K4M56163PI-BG75 | 1.000 | 11+ | Anfrage senden |
| K4M56163PI-BG750JR | 4.000 | Anfrage senden | |
| K4M56163PI-BG75 | 5.600 | Anfrage senden | |
| K4M56163PI-BG75 | 3.000 | Anfrage senden | |
| K4M56163PI-BG75 | 0 | Anfrage senden | |
| K4M56163PI-BG75 | 12.500 | Anfrage senden | |
| K4M56163PI-BG75 | 1 | Anfrage senden | |
| K4M56163PI-BG75 | 690 | 9 | Anfrage senden |
| K4M56163PI-BG75 | 1 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4M56163PC-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PE-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PF-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BE75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG750 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG7500 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75000 | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG75000SAMSUNG | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |
| K4M56163PG-BG750JR | FBGA | 1.8 V | 133 MHZ | -25 C~+85 C |