Bilder dienen nur der Illustration
| Hersteller-Nummer | K4P4G324EQ-RGC2 |
| Hersteller | SAMSUNG |
| Produktkategorie | LPDDR2 MOBILE |
| IC-Code | 128MX32 LPDDR2 |
| Gehäuse | FBGA-168 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.2 V |
| Betriebstemperatur | -25 C~+85 C |
| Geschwindigkeit | 1066 MBPS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 128M |
| Bit Organization | x32 |
| Density | 4G |
| Internal Banks | 8 Banks |
| Power | Low, i-TCSR & PASR & DS |
| Generation | 17th Generation |
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K4P4G324EQ-RGC2 | 3.924 | 1425+ | Anfrage senden |
| K4P4G324EQ-RGC2 | 3.974 | Anfrage senden | |
| K4P4G324EQ-RGC2 | 3.923 | 1425+ | Anfrage senden |
| K4P4G324EQ-RGC2 | 2.390 | 2014+ | Anfrage senden |
| K4P4G324EQ-RGC2 | 150 | 1346+ | Anfrage senden |
| K4P4G324EQ-RGC2 | 3.000 | Anfrage senden | |
| K4P4G324EQ-RGC2 | 5.000 | Anfrage senden |
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| K4P4G304EB-AGC2 | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| K4P4G324EB-AGC2 | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| K4P4G324EB-AGC2000 | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| K4P4G324EB-PGC2 | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| K4P4G324EC-AGC2 | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| K4P4G324EQ-PGC2 | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| K4P4G324EQ-SGC2TTN | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| MT42L128M32D2KL-18 IT ES:A | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| NT6TL128M32BQ-G0 | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |
| NT6TL128M32BQ-G0 TR | FBGA-168 | 1.2 V | 1066 MBPS | -25 C~+85 C |