MT29F1G08ABBHC-ETESB
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | MT29F1G08ABBHC-ETESB |
| Hersteller | MICRON |
| Produktkategorie | FLASH-NAND |
| IC-Code | 128MX8 NAND SLC |
Produktbeschreibung
| Gehäuse | VFBGA-63 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 1.8 V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 25 NS |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Number Of Words | 128M |
| Bit Organization | x8 |
| Density | 1G |
| Production Status | Production |
| Package Material | Pb-free |
| Features | Internal ECC enabled |
| Package | VFBGA(63-ball , 10.5 x 13 x 1.0) |
| Generation Feature Set | 2nd set of device features (rev only if different than 1st set) |
| Speed Grade | Async only |
| Design Revision | S |
| Classification | 1-0-0-1 (Die-nCE-RnB-IO Channels) |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| MT29F1G08ABBHC-ETESB | 0 | Anfrage senden | |
| MT29F1G08ABBHC-ETESB | 29.325 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| H27S1G8F2BFR-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2BFR-BI NBSP | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2BFR-BIR | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2CFE-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2CFR-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| IS35MW01G084-BLA1 | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| K9F1G08R08-JIBO | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A-/B-JIB | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A-JIB0000 | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A/B-JIB0 | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |