Bilder dienen nur der Illustration
Hersteller-Nummer | W25Q128JVCIQ |
Hersteller | WINBOND |
Produktkategorie | FLASH-QSPI-NOR |
IC-Code | 128MB SPI |
Gehäuse | TFBGA-24 |
Verpackung | |
RoHS | RoHS |
Spannungsversorgung | 2.7V~3.6V |
Betriebstemperatur | -40 C~+85 C |
Geschwindigkeit | 133 MHZ |
Standard Stückzahl | |
Abmessungen Karton | |
Density | 128M |
Product Family | SpiFlash serial flash memory with 4 KB sectors, Dual/Quad I/O |
Product Number Density | 128 Mbit |
Special Options | green package with QE=1 in status register-2 |
Company Prefix | winbond |
Teilenummer | Menge | Datecode | |
---|---|---|---|
W25Q128JVCIQ | 5.000 | Anfrage senden | |
W25Q128JVCIQ | 1.000 | Anfrage senden | |
W25Q128JVCIQ | 2.400 | Anfrage senden | |
W25Q128JVCIQ | 10.000 | 22+ | Anfrage senden |
W25Q128JVCIQ | 0 | Anfrage senden |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
MX25L12845GXDI-08G | TFBGA-24 | 3.3 V | 133 MHZ | -40 C~+85 C |
S25FL128LAGBHI020 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128LAGBHI023 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128LAGBHI030 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI20 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI200 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI203 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI210 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI30 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
S25FL128SAGBHI300 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |