W25Q512JVBIM
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | W25Q512JVBIM |
| Hersteller | WINBOND |
| Produktkategorie | FLASH-QSPI-NOR |
| IC-Code | 512MB SPI |
Produktbeschreibung
| Gehäuse | TFBGA-24 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 2.7V-3.6V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 133 MHZ |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Product Family | SpiFlash serial flash memory with 4 KB sectors, Dual/Quad I/O |
| Special Options | green package (Lead-free, RoHS compliant, Halogen-free(TBBA), Antimony-Oxide-free Sb2O3) & optimized for mobile applications |
| Company Prefix | winbond |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| W25Q512JVBIM | 1.000 | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| MT25QL512ABB8E12-OSIT | T-PBGA-24 | 2.7V~3.6V | 133 MHZ | -40 C~+85 C |
| MT25QL512ABB8EW9-0SIT | T-PBGA-24 | 2.7V~3.6V | 133 MHZ | -40 C~+85 C |
| MT25QL512ABBBE12-OSIT | T-PBGA-24 | 2.7V~3.6V | 133 MHZ | -40 C~+85 C |
| MT25QL512ABBBE12-OSIT M | T-PBGA-24 | 2.7V~3.6V | 133 MHZ | -40 C~+85 C |
| MX25L51245GXDI-08G | BGA-24 | 3.3 V | 133 MHZ | -40 C~+85 C |
| MX25L51245GXDI-08GTR | BGA-24 | 3.3 V | 133 MHZ | -40 C~+85 C |
| S25FL512SAGBFA | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
| S25FL512SAGBHA | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
| S25FL512SAGBHI21 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |
| S25FL512SAGBHI210 | BGA-24 | 3.0 V | 133 MHZ | -40 C~+85 C |