| Gehäuse | TSOP |
| Verpackung | |
| RoHS | Leaded |
| Spannungsversorgung | 2.7V~3.3V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | industrial 90ns |
| Standard Stückzahl | |
| Abmessungen Karton | |
| Density | 128M |
| Product Family | 3V (VCC= 2.7~3.6V) |
| Company Prefix | winbond |
| Product Version | 90nm |
| Sector Type | EVIO= 1.65V to VCC(2.7~3.6V), uniform sector, highest address sector protected |
| Packages | LFBGA-64, green (RoHS compliant) |