W29N01HVBINF
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | W29N01HVBINF |
| Hersteller | WINBOND |
| Produktkategorie | FLASH-NAND |
| IC-Code | 128MX8 NAND SLC |
Produktbeschreibung
| Gehäuse | VFBGA-63 |
| Verpackung | |
| RoHS | RoHS |
| Spannungsversorgung | 3.3 V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 25 NS |
| Standard Stückzahl | |
| Abmessungen Karton |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| W29N01HVBINF | 43.601 | Anfrage senden | |
| W29N01HVBINF | 22.136 | 2017+ | Anfrage senden |
| W29N01HVBINF | 100,000+ | Anfrage senden | |
| W29N01HVBINF | 43.631 | Anfrage senden | |
| W29N01HVBINF | 44.244 | Anfrage senden | |
| W29N01HVBINF | 44.209 | Anfrage senden | |
| W29N01HVBINF | 44.395 | Anfrage senden | |
| W29N01HVBINF | 44.414 | Anfrage senden | |
| W29N01HVBINF | 44.268 | Anfrage senden | |
| W29N01HVBINF | 1.800 | 17+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| EN27LN1G08-25CEIP | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| F59L1G81MA -25BIG2Y | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BIR | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2CFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI-TR | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G084-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G084-BLI-TR | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML08G168-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |