脚位/封装 | FBGA-90 |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.3 V |
温度规格 | -40 C~+85 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Bit Organization | x32 |
Package Material | lead & halogen free |
Hynix Memory | H |
No Of Banks | 4 banks |
Die Generation | 8th |
Product Family | DRAM |
Product Mode | SDR |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
IS42SM32800D-75BLI | FBGA-90 | 3.3 V | 133 MHZ | -40 C~+85 C |
IS42SM32800E-75BLI | FBGA-90 | 3.3 V | 133 MHZ | -40 C~+85 C |
IS42SM32800K-75BLI | FBGA-90 | 3.3 V | 133 MHZ | -40 C~+85 C |
IS45SM32800K-75BLA1 | FBGA-90 | 3.3 V | 133 MHZ | -40 C~+85 C |
IS45SM32800K-75BLA1-TR | FBGA-90 | 3.3 V | 133 MHZ | -40 C~+85 C |