| 脚位/封装 | TSOP2 |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 143 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Density | 16M |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 5th Gen. |
| No Of Banks | 2 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| AS4C1M16S-7TCN | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| AS4C1M16S-7TCN ALL | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| AS4C1M16S-7TCNTR | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| AS4C1M16S-7TCNTR ALL | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V16110DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161612DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161616ETP-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V16161DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161620DCT-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161620DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |