| 脚位/封装 | TSOP2(50) |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 143 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Density | 16M |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 3rd Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| EM636165-7 | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM6361656S-7 | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM6361656TS-7 | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM63616570 | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM636165BE-7G | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM636165TC7 | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM636165TS-6/7 | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM636165TS-6/7G | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM636165TS-6G/-7G | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |
| EM636165TS-7 | TSOP2(50) | 3.3 V | 143 MHZ | 0 C~+70 C |