| 脚位/封装 | TSOP2(50) |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.3 V |
| 温度规格 | |
| 速度 | 100 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 6th Gen. |
| No Of Banks | 2 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| HY57V161610ETP-6NBSP | 1,920 | 索取报价 |