HY57V281610HCT-H
产品详情
| 脚位/封装 | TSOP2 |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 133 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | normal |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 2 banks |
| Die Generation | 4th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| MT48LC8M16ATG-75L | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W981216AH75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W981216BH-75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W981216BH-75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W981216CH75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W981216DH-75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W981216EH75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W981216HB-75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |