脚位/封装 | TSOP2 |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 8M |
Bit Organization | x16 |
Density | 128M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | low power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V281620CTP-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620DET-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620DT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620ELT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620ELTP-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620ELTP-H-C | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620EPT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620EPT-H-C | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620EST-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620ET - H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |