| 脚位/封装 | TSOP2(54) |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 133 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 4th Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| HY57V281620HCTP-H | 431 | 索取报价 | |
| HY57V281620HCTP-H | 1,140 | 索取报价 | |
| HY57V281620HCTP-H | 431 | 200518+ | 索取报价 |
| HY57V281620HCTP-H | 4,856 | 2009+ | 索取报价 |
| HY57V281620HCTP-H | 1,400 | 4 | 索取报价 |
| HY57V281620HCTP-H | 867 | 2006+ | 索取报价 |
| HY57V281620HCTP-H | 5,000 | 2009+ | 索取报价 |
| HY57V281620HCTP-H | 10,000 | 2008+ | 索取报价 |
| HY57V281620HCTP-H | 5,000 | 索取报价 | |
| HY57V281620HCTP-H | 319 | /05+NOPB | 索取报价 |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| EDS1216AATA-75 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AATA-75-E | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AATA-75-E | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AATA-75-F | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AATA-75E (LEADFREE | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AATA-75L-E | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AATA-75TH-E | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AATA75E128MTSOP | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AGTA-75 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
| EDS1216AGTA-75-E | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |