| 脚位/封装 | TSOP2(54) |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 200 MHZ |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 1st Gen. |
| No Of Banks | 4 banks |
| Shipping Method | tray |
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| HY57V281622FTP-5 | 1,173 | 索取报价 |
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| HY57V281620AT-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620AT-75 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620ET-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620ETP-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620ETP-H, TSOP2-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620FTP-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620HCT-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620HCT-85 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620HGT-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V281620HGT-75 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |