脚位/封装 | TSOP2(54) |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 200 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 2nd Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
EM63A165TS-5G | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
EM63A165TSC-5G | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
HY57V561620CLT-75 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
HY57V561620ETP-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
HY57V561620FTP-5 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
HY57V561620T-75 | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
M12L2561616A | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
M12L2561616A-5TG2A | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
M12L2561616A-5TG2S | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |
M12L2561616A-5TVAG2A | TSOP2(54) | 3.3 V | 200 MHZ | 0 C~+70 C |