HY57V561620BLTC10
产品详情
| 脚位/封装 | TSOP2(54) |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | 0 C~+70 C |
| 速度 | 100 MHz |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 3rd Gen. |
| No Of Banks | 4 banks |
| Power Consumption | low power |
| Shipping Method | tray |