脚位/封装 | TSOP2(54) |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 133 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 4th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V561620HCTP-H | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HDT-H | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HGLT-H | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HGT-7 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HGT-H | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HGT-H-7 | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HLT-H | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HT-H | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HT-K | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V561620HTP-H | TSOP2(54) | 3.3 V | 133 MHZ | 0 C~+70 C |