HY57V641620HGLT-HI
产品详情
| 脚位/封装 | TSOP2(54) |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 3.3 V |
| 温度规格 | -40 C~+85 C |
| 速度 | PC133, CL3 |
| 标准包装数量 | |
| 标准外箱 | |
| Number Of Words | 4M |
| Bit Organization | x16 |
| Density | 64M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 5th Gen. |
| No Of Banks | 4 banks |
| Power Consumption | low power |
| Shipping Method | tray |
供应链有货
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| HY57V641620HGLT-HI | 6,358 | 2006+ | 索取报价 |
| HY57V641620HGLT-HI | 154 | /0250+ | 索取报价 |
| HY57V641620HGLT-HI | 756 | 索取报价 | |
| HY57V641620HGLT-HI | 500 | 2002+ | 索取报价 |
| HY57V641620HGLT-HI | 1,069 | 200250+ | 索取报价 |
| HY57V641620HGLT-HI | 5,145 | 02+ | 索取报价 |
| HY57V641620HGLT-HI | 8,000 | 02+ | 索取报价 |
| HY57V641620HGLT-HI | 9,000 | 02+ | 索取报价 |
| HY57V641620HGLT-HI | 10,000 | 01 | 索取报价 |
| HY57V641620HGLT-HI | 8,000 | 索取报价 |