HY57V64162ETP-HI-C
产品详情
| 脚位/封装 | TSOP2(54) |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | -40 C~+85 C |
| 速度 | PC133, CL3 |
| 标准包装数量 | |
| 标准外箱 | |
| Density | 64M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 6th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
| 脚位/封装 | TSOP2(54) |
| 外包装 | TRAY |
| 无铅/环保 | 含铅 |
| 电压(伏) | 3.3 V |
| 温度规格 | -40 C~+85 C |
| 速度 | PC133, CL3 |
| 标准包装数量 | |
| 标准外箱 | |
| Density | 64M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 6th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |