脚位/封装 | TSOP2(86) |
外包装 | TRAY |
无铅/环保 | 无铅/环保 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 143 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 4th Gen. |
Power Consumption | normal power |
Shipping Method | tray |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
UPD4564323G5A70E2 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
UPD456432G5-A70 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W9864320H-7 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W986432AH-7 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W986432DH-5/6/7 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W986432DH-6(-7) | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W986432DH-7 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W986432DH-7 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W986432EH-7 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |
W9864G2-IB7 | TSOP2(86) | 3.3 V | 143 MHZ | 0 C~+70 C |