脚位/封装 | TSOP2(86) |
外包装 | TRAY |
无铅/环保 | 含铅 |
电压(伏) | 3.3 V |
温度规格 | 0 C~+70 C |
速度 | 166 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 5th Gen. |
Power Consumption | super low power |
Shipping Method | tray |
IC 编号 | 数量 | 生产年份 | |
---|---|---|---|
HY57V643220DST-6 | 6,358 | 2006+ | 索取报价 |
IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
---|---|---|---|---|
HY57V643220DTP-6HYNIX | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220ET-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220ETP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220H-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220H-60 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220HCT-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220HGT6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220HGTC6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220HTP-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V643220T-6 | TSOP2(86) | 3.3 V | 166 MHZ | 0 C~+70 C |